Pateri

2041005

2041005

bahagian bahagian: 782

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan
2040989

2040989

bahagian bahagian: 87

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan
2164169

2164169

bahagian bahagian: 95

Jenis: Solder Paste, Komposisi: Bi58Sn42 (58/42), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
2023641

2023641

bahagian bahagian: 748

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
2003721

2003721

bahagian bahagian: 615

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
2023628

2023628

bahagian bahagian: 826

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
2041006

2041006

bahagian bahagian: 716

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan
2064242

2064242

bahagian bahagian: 9179

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
2064239

2064239

bahagian bahagian: 9231

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
289398

289398

bahagian bahagian: 9095

Senarai harapan
397127

397127

bahagian bahagian: 1777

Jenis: Wire Solder, Komposisi: Sn62Pb38 (62/38), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
395442

395442

bahagian bahagian: 2270

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.064" (1.63mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
386849

386849

bahagian bahagian: 1290

Jenis: Wire Solder, Diameter: 0.032" (0.81mm), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386838

386838

bahagian bahagian: 2509

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.048" (1.22mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
395467

395467

bahagian bahagian: 2568

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.048" (1.22mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
386848

386848

bahagian bahagian: 1234

Jenis: Wire Solder, Diameter: 0.032" (0.81mm), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386863

386863

bahagian bahagian: 1228

Jenis: Wire Solder, Diameter: 0.022" (0.56mm), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
386874

386874

bahagian bahagian: 1708

Jenis: Wire Solder, Diameter: 0.015" (0.38mm), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
389289

389289

bahagian bahagian: 4536

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
395465

395465

bahagian bahagian: 2218

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.064" (1.63mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
386857

386857

bahagian bahagian: 2250

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386827

386827

bahagian bahagian: 2129

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386839

386839

bahagian bahagian: 2231

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
392249

392249

bahagian bahagian: 2212

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.064" (1.63mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
397102

397102

bahagian bahagian: 2222

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.048" (1.22mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
386851

386851

bahagian bahagian: 2094

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
395439

395439

bahagian bahagian: 2459

Jenis: Wire Solder, Komposisi: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Diameter: 0.050" (1.27mm), Takat lebur: 565 ~ 574°F (296 ~ 301°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
395451

395451

bahagian bahagian: 2104

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386818

386818

bahagian bahagian: 2276

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386825

386825

bahagian bahagian: 2287

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
386832

386832

bahagian bahagian: 2325

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
386876

386876

bahagian bahagian: 2070

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
395437

395437

bahagian bahagian: 2107

Jenis: Wire Solder, Komposisi: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Diameter: 0.028" (0.71mm), Takat lebur: 565 ~ 574°F (296 ~ 301°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 21 AWG, 22 SWG,

Senarai harapan
386820

386820

bahagian bahagian: 3632

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
397982

397982

bahagian bahagian: 3619

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
386824

386824

bahagian bahagian: 2104

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.024" (0.61mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan