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Pateri

727190
Multicore

727190

bahagian bahagian: 1836

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
732998
Multicore

732998

bahagian bahagian: 1045

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
732977
Multicore

732977

bahagian bahagian: 1027

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
796065
Multicore

796065

bahagian bahagian: 1423

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
796037
Multicore

796037

bahagian bahagian: 1476

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
733002
Multicore

733002

bahagian bahagian: 1052

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
733001
Multicore

733001

bahagian bahagian: 1790

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
733010
Multicore

733010

bahagian bahagian: 9081

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
848874
Multicore

848874

bahagian bahagian: 1460

Jenis: Wire Solder, Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
865940
Multicore

865940

bahagian bahagian: 2047

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
840933
Multicore

840933

bahagian bahagian: 2457

Jenis: Wire Solder, Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
893357
Multicore

893357

bahagian bahagian: 2447

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
838498
Multicore

838498

bahagian bahagian: 1827

Jenis: Wire Solder, Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
818006
Multicore

818006

bahagian bahagian: 3362

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.028" (0.71mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 21 AWG, 22 SWG,

Senarai harapan
849328
Multicore

849328

bahagian bahagian: 6921

Jenis: Wire Solder, Diameter: 0.064" (1.63mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
981501
Multicore

981501

bahagian bahagian: 9089

Jenis: Bar Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C),

Senarai harapan
MM01075
Multicore

MM01075

bahagian bahagian: 9080

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
MM01039
Multicore

MM01039

bahagian bahagian: 9055

Jenis: Wire Solder, Komposisi: Sn62Pb38 (62/38), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan