Pateri

Rumah
Pateri

1051209

bahagian bahagian: 1163

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan

1051208

bahagian bahagian: 961

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan

1769647

bahagian bahagian: 724

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1405711

bahagian bahagian: 85

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan

1769646

bahagian bahagian: 797

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1817240

bahagian bahagian: 1319

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C),

Senarai harapan

1817250

bahagian bahagian: 1110

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C),

Senarai harapan

1394819

bahagian bahagian: 2054

Jenis: Solder Paste, Takat lebur: 546 ~ 567°F (286 ~ 297°C),

Senarai harapan

1042100

bahagian bahagian: 750

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan

1042097

bahagian bahagian: 1485

Jenis: Wire Solder, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Diameter: 0.063" (1.60mm), Takat lebur: 430°F (221°C), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan

1354296

bahagian bahagian: 1005

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan

1354298

bahagian bahagian: 1183

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan

1179441

bahagian bahagian: 2529

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan

1179443

bahagian bahagian: 4849

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan

1372425

bahagian bahagian: 9171

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan

1371245

bahagian bahagian: 6982

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan

1007354

bahagian bahagian: 1447

Jenis: Solder Paste, Komposisi: Bi58Sn42 (58/42), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan

1728117

bahagian bahagian: 88

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1844674

bahagian bahagian: 93

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 411 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan

1844657

bahagian bahagian: 63

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 410 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan

1993881

bahagian bahagian: 824

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1844644

bahagian bahagian: 47

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 409 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan

1846154

bahagian bahagian: 79

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1844641

bahagian bahagian: 97

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 408 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan

1434537

bahagian bahagian: 46

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Senarai harapan

1434501

bahagian bahagian: 49

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Senarai harapan

1844685

bahagian bahagian: 41

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 401 ~ 424°F (205 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan

1434504

bahagian bahagian: 27

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Senarai harapan

1747469

bahagian bahagian: 156

Jenis: Solder Paste, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan

1354222

bahagian bahagian: 9183

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Senarai harapan

1405673

bahagian bahagian: 9223

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

1405650

bahagian bahagian: 9214

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

1354291

bahagian bahagian: 9161

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

1354250

bahagian bahagian: 6927

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

1354225

bahagian bahagian: 9135

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

2040987

bahagian bahagian: 91

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble,

Senarai harapan

126

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