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Pateri

386862
Multicore

386862

bahagian bahagian: 2246

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
397952
Multicore

397952

bahagian bahagian: 3851

Jenis: Wire Solder, Komposisi: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Diameter: 0.022" (0.56mm), Takat lebur: 565 ~ 574°F (296 ~ 301°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
389261
Multicore

389261

bahagian bahagian: 3668

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.015" (0.38mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
386844
Multicore

386844

bahagian bahagian: 3649

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
389283
Multicore

389283

bahagian bahagian: 4005

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
386826
Multicore

386826

bahagian bahagian: 9072

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
386840
Multicore

386840

bahagian bahagian: 9036

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
412183
Multicore

412183

bahagian bahagian: 1331

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.040" (1.02mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
412188
Multicore

412188

bahagian bahagian: 1725

Jenis: Wire Solder, Diameter: 0.015" (0.38mm), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
412185
Multicore

412185

bahagian bahagian: 1962

Jenis: Wire Solder, Diameter: 0.022" (0.56mm), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
450314
Multicore

450314

bahagian bahagian: 1924

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
421562
Multicore

421562

bahagian bahagian: 2282

Jenis: Wire Solder, Diameter: 0.040" (1.02mm), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
403674
Multicore

403674

bahagian bahagian: 4559

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
437756
Multicore

437756

bahagian bahagian: 9154

Jenis: Wire Solder, Komposisi: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
544784
Multicore

544784

bahagian bahagian: 2648

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
536290
Multicore

536290

bahagian bahagian: 178

Jenis: Wire Solder, Komposisi: Sn97Cu3 (97/3), Diameter: 0.128" (3.25mm), Wire Gauge: 8 AWG, 10 SWG,

Senarai harapan
568759
Multicore

568759

bahagian bahagian: 7001

Jenis: Wire Solder, Komposisi: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Diameter: 0.048" (1.22mm), Takat lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
554889
Multicore

554889

bahagian bahagian: 9039

Jenis: Bar Solder, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C),

Senarai harapan
583489
Multicore

583489

bahagian bahagian: 9083

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
550014
Multicore

550014

bahagian bahagian: 6912

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
662727
Multicore

662727

bahagian bahagian: 1880

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan
692857
Multicore

692857

bahagian bahagian: 1257

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
605500
Multicore

605500

bahagian bahagian: 2228

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
673832
Multicore

673832

bahagian bahagian: 1097

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
673831
Multicore

673831

bahagian bahagian: 1016

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.048" (1.22mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
673828
Multicore

673828

bahagian bahagian: 1703

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
673829
Multicore

673829

bahagian bahagian: 1036

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
680290
Multicore

680290

bahagian bahagian: 2194

Jenis: Bar Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Takat lebur: 440 ~ 464°F (227 ~ 240°C),

Senarai harapan
721473
Multicore

721473

bahagian bahagian: 2015

Jenis: Solder Paste, Jenis Flux: No-Clean,

Senarai harapan
732997
Multicore

732997

bahagian bahagian: 1370

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
732999
Multicore

732999

bahagian bahagian: 1406

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.048" (1.22mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
716856
Multicore

716856

bahagian bahagian: 1151

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.064" (1.63mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
733024
Multicore

733024

bahagian bahagian: 2200

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Senarai harapan
721472
LOCTITE

721472

bahagian bahagian: 116

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
721440
LOCTITE

721440

bahagian bahagian: 112

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan
721471
LOCTITE

721471

bahagian bahagian: 72

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Senarai harapan