Permohonan: Solenoid Monitor, Semasa - Bekalan: 1mA, Voltan - Bekalan: 7V ~ 17V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.295", 7.50mm Width),
Permohonan: Handheld/Mobile Devices, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 247-TFBGA,
Permohonan: PC's, PDA's, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 338-TFBGA,
Permohonan: Automotive, Semasa - Bekalan: 6.5mA, Voltan - Bekalan: 7V ~ 18V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.295", 7.50mm Width),
Permohonan: Automotive, Semasa - Bekalan: 42mA, Voltan - Bekalan: 5.5V ~ 18V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-SOIC (0.295", 7.50mm Width),
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 186-LFBGA,
Permohonan: System Basis Chip, Semasa - Bekalan: 7mA, Voltan - Bekalan: 3.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: Automotive, Semasa - Bekalan: 310µA, Voltan - Bekalan: 11V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 17-SIP Formed Leads,
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 110µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 17-SIP Formed Leads,
Permohonan: System Basis Chip, Semasa - Bekalan: 2mA, Voltan - Bekalan: 5.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Automotive Airbag System, Voltan - Bekalan: 5.2V ~ 20V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 64-LQFP Exposed Pad,
Permohonan: General Purpose, Supervisor, Sequence, Semasa - Bekalan: 7.5mA, Voltan - Bekalan: 13V ~ 32V, Suhu Operasi: 0°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 9-SIP Exposed Tab,
Permohonan: Wireless Power Transmitter, Semasa - Bekalan: 2mA, Voltan - Bekalan: 3.5V ~ 5.25V, Suhu Operasi: -20°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-VFQFN Exposed Pad,
Permohonan: Automotive, Semasa - Bekalan: 6mA, Voltan - Bekalan: 8V ~ 18V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.154", 3.90mm Width),
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 300µA, Voltan - Bekalan: 9V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 23-SIP Formed Leads,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 139-TFBGA,
Permohonan: Automotive, Semasa - Bekalan: 400µA, Voltan - Bekalan: 11V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 17-SIP Formed Leads,
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.295", 7.50mm Width),
