Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 186-LFBGA,
Permohonan: Handheld/Mobile Devices, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 247-TFBGA,
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 139-TFBGA,
Permohonan: Automotive, Semasa - Bekalan: 6mA, Voltan - Bekalan: 8V ~ 18V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Pump, Valve Controller, Voltan - Bekalan: 6V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 64-LQFP Exposed Pad,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: Automotive, Voltan - Bekalan: 4V ~ 24V, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Wireless Power Receiver, Semasa - Bekalan: 12mA, Voltan - Bekalan: 6.1V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 42-UFBGA, WLCSP,
Permohonan: Automotive, Semasa - Bekalan: 500µA, Voltan - Bekalan: 8V ~ 16V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-SOIC (0.295", 7.50mm Width),
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.295", 7.50mm Width),
Permohonan: Automotive, Semasa - Bekalan: 10mA, Voltan - Bekalan: 4.7V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 110µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.433", 11.00mm Width) Exposed Pad,
Permohonan: System Basis Chip, Semasa - Bekalan: 7mA, Voltan - Bekalan: 3.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: System Basis Chip, Semasa - Bekalan: 2mA, Voltan - Bekalan: 5.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Automotive, Semasa - Bekalan: 6mA, Voltan - Bekalan: 8V ~ 18V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.154", 3.90mm Width),
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.295", 7.50mm Width),
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Wireless Power Receiver, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 42-UFBGA, WLCSP,
Jenis Pemasangan: Surface Mount, Pakej / Kes: 80-LQFP Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 5µA, Voltan - Bekalan: 9.5V ~ 17.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 9-SIP Formed Leads,
Semasa - Bekalan: 26mA, Suhu Operasi: 0°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.295", 7.50mm Width),
