Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,
Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,
Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,
Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,
Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,
Permohonan: General Purpose, Voltan - Bekalan: 1.8V ~ 4.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 206-LFBGA,
Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 110µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.433", 11.00mm Width) Exposed Pad,
Permohonan: Isolated Communications Interface, Semasa - Bekalan: 40mA, Voltan - Bekalan: 4.5V ~ 7V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.154", 3.90mm Width),
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 139-TFBGA,
Permohonan: Audio, Video, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: 0°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,