PMIC - Pengurusan Kuasa - Khusus

MC34PF3001A5EPR2

bahagian bahagian: 166

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF1510A5EP

bahagian bahagian: 111

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MCZ33810EKR2

bahagian bahagian: 28932

Permohonan: Automotive, Semasa - Bekalan: 10mA, Voltan - Bekalan: 4.5V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,

MC34911G5AC

bahagian bahagian: 39092

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MC34PF1510A7EP

bahagian bahagian: 180

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC34709VKR2

bahagian bahagian: 24513

Permohonan: Processor, Semasa - Bekalan: 370µA, Voltan - Bekalan: 3V ~ 4.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 130-LFBGA,

UJA1131HW/FD/5V/0Y

bahagian bahagian: 129

MC32PF4210A1ESR2

bahagian bahagian: 111

Permohonan: Audio, Video, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: 0°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

UJA1132HW/FD/3V/4Y

bahagian bahagian: 207

MC33FS6502CAER2

bahagian bahagian: 196

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF3001A2EP

bahagian bahagian: 132

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC35FS4502CAER2

bahagian bahagian: 117

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34704BEPR2

bahagian bahagian: 26113

Permohonan: Processor, Semasa - Bekalan: 86mA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-TFQFN Exposed Pad,

MC34PF4210A1ESR2

bahagian bahagian: 81

Permohonan: Audio, Video, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC32PF1550A4EP

bahagian bahagian: 181

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC13892CJVLR2

bahagian bahagian: 22223

Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 186-LFBGA,

MWCT1011BVLHR

bahagian bahagian: 119

MC34VR5100A0EP

bahagian bahagian: 16464

Permohonan: LS1 Communication Processors, Semasa - Bekalan: 450µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF1550A4EPR2

bahagian bahagian: 16516

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MWPR1516CFM

bahagian bahagian: 16019

Permohonan: Wireless Power Receiver, Semasa - Bekalan: 120mA, Voltan - Bekalan: 3.5V ~ 20V, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-UFQFN Exposed Pad,

MC35FS6500NAER2

bahagian bahagian: 142

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34VR5100A2EPR2

bahagian bahagian: 2943

Permohonan: LS1 Communication Processors, Semasa - Bekalan: 450µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33FS4502NAER2

bahagian bahagian: 207

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC35FS4503NAER2

bahagian bahagian: 126

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MWCT1200CFM

bahagian bahagian: 15622

Permohonan: Wireless Power Transmitter, Semasa - Bekalan: 300µA, Voltan - Bekalan: 2.7V ~ 3.6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-VFQFN Exposed Pad,

MC34PF3001A3EP

bahagian bahagian: 22187

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF3000A1EPR2

bahagian bahagian: 153

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34VR500V2ESR2

bahagian bahagian: 18181

Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC34PF3000A0EP

bahagian bahagian: 17692

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A1EP

bahagian bahagian: 19208

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34VR500V3ESR2

bahagian bahagian: 18149

Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC34PF1510A2EP

bahagian bahagian: 103

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC34FS6408NAER2

bahagian bahagian: 196

Permohonan: System Basis Chip, Semasa - Bekalan: 13mA, Voltan - Bekalan: 2.7V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF3000A7EP

bahagian bahagian: 2983

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33FS4501CAER2

bahagian bahagian: 175

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33FS6510LAER2

bahagian bahagian: 177

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,