PMIC - Pengurusan Kuasa - Khusus

UJA1131HW/5V0,518

bahagian bahagian: 154

MC34VR500V7ESR2

bahagian bahagian: 160

Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC33PF3001A6ES

bahagian bahagian: 186

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33PF3000A6ESR2

bahagian bahagian: 142

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF1550A6EP

bahagian bahagian: 154

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC33PF3000A6ES

bahagian bahagian: 128

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC35FS6511NAER2

bahagian bahagian: 168

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33SB0401ES

bahagian bahagian: 11717

Permohonan: Motorcycle Braking, Voltan - Bekalan: 6V ~ 20V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3001A4EP

bahagian bahagian: 128

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC35FS6502CAER2

bahagian bahagian: 104

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33PF3000A4ESR2

bahagian bahagian: 3446

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33FS4500NAER2

bahagian bahagian: 132

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34912G5AC

bahagian bahagian: 38026

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MC32PF1550A2EP

bahagian bahagian: 96

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC34PF3000A2EP

bahagian bahagian: 17607

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

UJA1136HW/3V3Y

bahagian bahagian: 151

MC34VR5100A0EPR2

bahagian bahagian: 129

Permohonan: LS1 Communication Processors, Semasa - Bekalan: 450µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33912BAC

bahagian bahagian: 35664

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MWPR1516CALR

bahagian bahagian: 22339

Permohonan: Wireless Power Receiver, Semasa - Bekalan: 120mA, Voltan - Bekalan: 3.5V ~ 20V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 36-UFBGA, WLCSP,

MC33FS6520LAER2

bahagian bahagian: 177

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33FS6502LAER2

bahagian bahagian: 148

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33PF3001A7ES

bahagian bahagian: 163

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33FS6521NAER2

bahagian bahagian: 135

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34704AEPR2

bahagian bahagian: 25703

Permohonan: Processor, Semasa - Bekalan: 86mA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-TFQFN Exposed Pad,

MC33FS4503NAER2

bahagian bahagian: 144

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF3000A2EPR2

bahagian bahagian: 150

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A0EPR2

bahagian bahagian: 123

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF3000A2EPR2

bahagian bahagian: 175

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A4EPR2

bahagian bahagian: 105

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34708VK

bahagian bahagian: 13856

Permohonan: General Purpose, Voltan - Bekalan: 1.8V ~ 4.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 206-LFBGA,

MC34FS6407NAER2

bahagian bahagian: 159

Permohonan: System Basis Chip, Semasa - Bekalan: 13mA, Voltan - Bekalan: 2.7V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF1550A3EPR2

bahagian bahagian: 16586

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC35FS6501NAER2

bahagian bahagian: 7222

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF3000A5EPR2

bahagian bahagian: 139

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A3EP

bahagian bahagian: 1339

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

UJA1135HW/3V3Y

bahagian bahagian: 213