PMIC - Pengurusan Kuasa - Khusus

MC34PF3000A4EP

bahagian bahagian: 18351

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC33FS6511NAER2

bahagian bahagian: 192

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34PF3001A2EPR2

bahagian bahagian: 119

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF1550A1EPR2

bahagian bahagian: 103

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC32PF3000A8EPR2

bahagian bahagian: 121

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

UJA1136HW/5V0Y

bahagian bahagian: 164

MCZ33800EKR2

bahagian bahagian: 24842

Permohonan: Automotive, Semasa - Bekalan: 10mA, Voltan - Bekalan: 5V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 54-SSOP (0.295", 7.50mm Width) Exposed Pad,

MC34VR500V5ESR2

bahagian bahagian: 139

Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC33FS6500LAER2

bahagian bahagian: 129

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC35FS4500NAE

bahagian bahagian: 190

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34PF1550A1EP

bahagian bahagian: 155

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC33910BAC

bahagian bahagian: 38529

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MC34VR500V8ESR2

bahagian bahagian: 202

Permohonan: QorlQ LS1/T1 Communications Processors, Semasa - Bekalan: 250µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Wettable Flank, Pakej / Kes: 56-VFQFN Exposed Pad,

MC34VR5100A1EPR2

bahagian bahagian: 195

Permohonan: LS1 Communication Processors, Semasa - Bekalan: 450µA, Voltan - Bekalan: 2.8V ~ 4.5V, Suhu Operasi: -40°C ~ 105°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF3001A5EP

bahagian bahagian: 22187

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF1550A2EP

bahagian bahagian: 128

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC34PF3001A2EP

bahagian bahagian: 22147

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A1EPR2

bahagian bahagian: 104

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC35FS4500NAER2

bahagian bahagian: 121

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

UJA1131HW/3V3Y

bahagian bahagian: 211

MC33FS4502LAER2

bahagian bahagian: 157

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34PF3000A8EP

bahagian bahagian: 173

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC32PF3000A6EPR2

bahagian bahagian: 125

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF1550A2EPR2

bahagian bahagian: 103

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC33910G5AC

bahagian bahagian: 57626

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MC35FS4501CAER2

bahagian bahagian: 198

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC32PF3000A5EP

bahagian bahagian: 1614

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC34PF1510A3EP

bahagian bahagian: 138

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC33FS6500NAER2

bahagian bahagian: 193

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC34PF3000A1EP

bahagian bahagian: 18269

Permohonan: i.MX Processors, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

MC35FS4502NAER2

bahagian bahagian: 167

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

MC33FS6512NAER2

bahagian bahagian: 184

Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 125°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,

UJA1131HW/FD/3V/0Y

bahagian bahagian: 215

MC33912G5AC

bahagian bahagian: 47199

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

MC34PF1510A6EP

bahagian bahagian: 97

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

MC33PF3001A7ESR2

bahagian bahagian: 144

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,