PMIC - Pengurusan Kuasa - Khusus | Litar Bersepadu (IC) | 16

MC32PF3001A5EPR2

bahagian bahagian: 148

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34910G5AC

bahagian bahagian: 44831

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF3001A7EPR2

bahagian bahagian: 161

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1550A5EP

bahagian bahagian: 97

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A5EPR2

bahagian bahagian: 186

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC33911G5AC

bahagian bahagian: 51825

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC33910BACR2

bahagian bahagian: 53531

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC32PF1550A7EPR2

bahagian bahagian: 100

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A6EPR2

bahagian bahagian: 170

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A3EPR2

bahagian bahagian: 16572

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC33912BACR2

bahagian bahagian: 42330

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC34910BACR2

bahagian bahagian: 67610

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC34911G5ACR2

bahagian bahagian: 57905

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC33910G5ACR2

bahagian bahagian: 61889

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC34827A1EPR2

bahagian bahagian: 85634

Permohonan: OR Controller, UART/USB Data, Audio Management, Semasa - Bekalan: 9µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-UFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A7EPR2

bahagian bahagian: 158

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A2EPR2

bahagian bahagian: 91

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1550A7EP

bahagian bahagian: 178

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34PF1510A5EPR2

bahagian bahagian: 138

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34912BACR2

bahagian bahagian: 52860

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC34827A2EPR2

bahagian bahagian: 85671

Permohonan: OR Controller, UART/USB Data, Audio Management, Semasa - Bekalan: 9µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-UFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF3001A3EPR2

bahagian bahagian: 115

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34PF3001A7EPR2

bahagian bahagian: 113

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF1510A1EPR2

bahagian bahagian: 16551

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC33PF3001A6ESR2

bahagian bahagian: 148

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC33911G5ACR2

bahagian bahagian: 55731

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC32PF3001A2EPR2

bahagian bahagian: 109

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34910BAC

bahagian bahagian: 45666

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC34PF1510A2EPR2

bahagian bahagian: 114

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF3001A1EPR2

bahagian bahagian: 153

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34911BACR2

bahagian bahagian: 57900

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC33911BACR2

bahagian bahagian: 55644

Permohonan: System Basis Chip, Semasa - Bekalan: 4.5mA, Voltan - Bekalan: 5.5V ~ 27V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP,

Senarai harapan

NXP USA Inc.

MC32PF3001A4EPR2

bahagian bahagian: 179

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC32PF3001A6EPR2

bahagian bahagian: 124

Permohonan: Processor, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,

Senarai harapan

NXP USA Inc.

MC34PF1510A3EPR2

bahagian bahagian: 173

Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,

Senarai harapan